Micro SD 4.0 Kaartenanschluss Push-Push, H 1,3 mm KLS1-SD4.0-003
Produktbiller
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Produktinformatiounen
Micro SD 4.0 Kaartenanschluss Push-Push, H 1,3 mm
Material:
Isolator: Thermoplastik, patinéiert UL94V-0.
Kontakter: Phosphorbronze.
Schuel: Edelstol.
Kontakt Beschichtung:
Ënnerplack: 50u”-100u” Néckel
Ënnerplack: 50u”-100u” Néckel
Kontaktberäich: Gold Flash
Läitschwanzfläche: 100u”-200u” Zinn
Elektresch:
Betribsspannung: 10V
Stroum Bewäertung: 0.5A Min.
Kontaktwidderstand: 100mΩ Max.
Isolatiounswiderstand: 1000MΩ
Dielektresch Widderstandsspannung: 500VAC/1 Minutt.
Paarungszyklen: 3000 Insertiounen
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